This device is designed for thin base materials (copper foil 10µm, film total 12.5µm) and can coat both sides of a thick substrate (2mm) with very uniform film thicknesses.
By coating and drying both sides simultaneously, the process time is reduced, increasing productivity.
Compatible Board Size:
Minimum: 360 x 360mm
Maximum: 600 x 600mm
Production Capacity:
Up to 6 pieces per minute
The unique 4-head chucking system allows for smooth coating, preventing wrinkles.
Application Examples:
Coating of photoresist and solder resist for PCB and FPC
Coating of AG/AR ink on optical film
Coating of engineering plastics with hard coat agents