Precision Double-Sided Coating Equipment for Film

This device is designed for thin base materials (copper foil 10µm, film total 12.5µm) and can coat both sides of a thick substrate (2mm) with very uniform film thicknesses.

By coating and drying both sides simultaneously, the process time is reduced, increasing productivity.

Compatible Board Size:

  • Minimum: 360 x 360mm
  • Maximum: 600 x 600mm

Production Capacity:

  • Up to 6 pieces per minute

The unique 4-head chucking system allows for smooth coating, preventing wrinkles.

Application Examples:

  • Coating of photoresist and solder resist for PCB and FPC
  • Coating of AG/AR ink on optical film
  • Coating of engineering plastics with hard coat agents
  • Coating of functional resin on metal foil

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